发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus which can increase a throughput and selectivity in epitaxial growth using at least one of a silane-based gas and a germane-based gas and a chlorine gas. SOLUTION: The method comprises a first step of transporting a wafer 200 having an insulating layer in part of its surface and having a silicon layer exposed thereon into a reaction tube 203, a second step of supplying a source gas containing silane-based gas or a germane-based gas in the reaction tube 203, a third step of supplying a chlorine gas into the reaction tube 203, a fourth step of supplying a hydrogen gas into the reaction tube 203, and a fifth step of growing a silicon epitaxial film on the exposed silicon layer repetitively by a plurality of times. The quantity of chlorine gas supplied in the third step is set at 10-1,000 sccm. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294690(A) 申请公布日期 2005.10.20
申请号 JP20040110005 申请日期 2004.04.02
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OGAWA ARIHITO
分类号 H01L21/205;H01L29/78;(IPC1-7):H01L21/205 主分类号 H01L21/205
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