| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which can be well soldered and can be reduced in size, and to provide a method of soldering the same. SOLUTION: The printed wiring board 14 is equipped with lands 14a and 14b having through-holes TH through which terminal members 15a and 15b of a component to be mounted are passed. The terminal members 15a and 15b and the lands are joined together by passing the terminal members 15a and 15b through the through-holes of the lands 14a and 14b and then soldering the terminal members 15a and 15b to the lands 14a and 14b by flow soldering. When performing flow soldering from the side where the terminal members 15a and 15b are projecting, dumping lands 16A and 16B are formed on the downstream side of soldering the lands 14a and 14b. The waste lands 16A and 16B are formed away from the lands 14a and 14b and are not joined to the terminal members 15a and 15b, and only the solder is remained. COPYRIGHT: (C)2006,JPO&NCIPI
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