发明名称 METHOD OF MANUFACTURING OPTICAL TRANSMITTING ASSEMBLY
摘要 <P>PROBLEM TO BE SOLVED: To provide a small optical transmitting assembly capable of performing cheap and high speed drive and an optical transceiver containing the optical transmitting assembly. <P>SOLUTION: The optical transmitting assembly loads an electronic cooler on a metal base plate, and loads a semiconductor light emitting diode on this electronic cooler through an insulating substrate. Primary and secondary laminated ceramic boards are provided so as to surround the electronic cooler. A control signal of d.c. or low frequency to the semiconductor light emitting diode is supplied to the semiconductor light emitting diode through the primary laminated ceramic board. A high frequency driving signal of the semiconductor light emitting diode is supplied to the semiconductor light emitting diode with a complementary signal having a reversed phase through an internal layer wiring of the secondary laminated ceramic board and the insulating substrate. A semiconductor light receiving element monitoring an output light-intensity of the semiconductor light emitting diode is loaded on the secondary laminated ceramic board. A line for transmitting a high frequency signal from a driving IC loaded outside the optical transmitting assembly to the semiconductor light emitting diode can be provided in a substantially straight line and shortest path. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294808(A) 申请公布日期 2005.10.20
申请号 JP20050040509 申请日期 2005.02.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KIHARA TOSHIAKI;GO HISAO;KATO KIYOSHI
分类号 G02B6/42;G01R31/26;G01R31/28;G02B6/34;H01L21/50;H01L21/66;H01S5/02;H01S5/022;H01S5/024 主分类号 G02B6/42
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