| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise assembling accuracy such as positioning of each component and improve productivity and quality by simplifying the assembling process of electronic device and metal package thereof, and also reducing the number of processes. <P>SOLUTION: In the lead frame 14 of a terminal component, a metal lead frame 2 with many metal base components 3 integrally formed thereon via a coupling portion 8 is allocated on a jig 1 with the lower surface side thereof turned upward. Further, a glass tablet 12 for sealing glass is also allocated to the internal side of the circumferential wall 6 at the lower surface of the metal base component, and many sets of terminal components 15 are integrally formed thereon via a coupling portion 19. This lead frame 14 of the terminal component is allocated with each mount electrode 17 thereof inserted into a through-hole 13 of the corresponding glass tablet and into a terminal hole 5 of the metal base component. Moreover, the lead frame 14 is heated under the condition that an overlapping jig is allocated thereon. The metal base component and terminal component are sealed with the sealing glass. Consequently, a plurality of metal bases 23 can be formed simultaneously. The coupling portion is cut away after a piezoelectric vibrating piece 25 is mounted to each metal base under this condition. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
