| 发明名称 |
System and method for reducing or eliminating semiconductor device wire sweep |
| 摘要 |
A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.
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| 申请公布号 |
US6955949(B2) |
申请公布日期 |
2005.10.18 |
| 申请号 |
US20030686974 |
申请日期 |
2003.10.16 |
| 申请人 |
KULICKE & SOFFA INVESTMENTS, INC. |
发明人 |
BATISH RAKESH;HMIEL ANDREW F.;SANDGREN GLENN;VONSEGGERN WALT;KULICKE C. SCOTT |
| 分类号 |
H01L21/44;H01L21/4763;H01L21/48;H01L21/50;H01L21/56;H01L21/603;H01L21/607;H01L23/49;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
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