| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treating equipment for wafer capable of reliably detecting the deformation of a heat treating boat to inspect the shape of the boat with high precision, and of obviating the occurrence of the omission of a wafer and fracture in the wafer, breakage of heat treating boat body and transfer equipment, and the like, caused by the deformation of the heat treating boat, and to provide a heat treating method for the wafer. SOLUTION: The heat treating equipment 1 for heat treating a wafer 5 comprises a heat treating boat 3 for placing at least the wafer, a heat-treating furnace 2 for inserting the heat treating boat to heat treating the wafer, a heating-means 10 for heating the wafer placed on the heat treating boat, and a detection sensor 8 for detecting the deformation of the heat treating boat, before placing the wafer on the heat treating boat and/or before taking out the wafer from the heat treating boat, after the heat treating of the wafer. The heat treating method for the wafer is also provided. COPYRIGHT: (C)2006,JPO&NCIPI |
