发明名称 HEAT-CONDUCTIVE MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a heat-conductive molding that has excellent thermal conductivity performance and readily increases handleability. SOLUTION: The heat-conductive molding comprises a heat-conductive composition composed of (a) a thermoplastic silicone resin that is constituted of a copolymer consisting of an RSiO<SB>3/2</SB>unit and an R<SB>3</SB>SiO<SB>1/2</SB>unit and has 50-70°C heat softening temperature, (b) a branched polyorganosiloxane resin that is constituted of a copolymer consisting of an RSiO<SB>3/2</SB>unit, an R<SB>3</SB>SiO<SB>1/2</SB>unit and an R<SB>2</SB>SiO<SB>2/2</SB>unit and has 25-45°C heat softening temperature, (c) silicone crude rubber constituted of a copolymer consisting of an R<SB>3</SB>SiO<SB>1/2</SB>unit and R<SB>2</SB>SiO<SB>2/2</SB>unit and (d) a heat-conductive filler. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281612(A) 申请公布日期 2005.10.13
申请号 JP20040101033 申请日期 2004.03.30
申请人 POLYMATECH CO LTD 发明人 FUJISAWA HIROYUKI
分类号 C08J5/18;C08K3/00;C08L83/04;H01L23/36;H01L23/373;(IPC1-7):C08L83/04 主分类号 C08J5/18
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