发明名称 SURFACE TREATMENT METHOD AND SURFACE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface treatment method and surface treatment apparatus capable of uniformly performing a plasma treatment of respective surfaces of a substrate to be treated. <P>SOLUTION: The surface treatment method for working a member to be treated having a plurality of surfaces by the plasma discharge treatment includes a process (S 10) of arranging the member 150 to be treated between a plurality of counter electrodes within a chamber, processes (S 20 to S 40) of performing plasma discharge between the member to be treated and the plurality of the counter electrodes and measuring the electric constant of the chamber, a regulation process (S 50) of regulating the relative position relation between the surface to be treated of the member 150 to be treated and the plurality of counter electrodes opposed thereto, a process (S 60) of subjecting the surfaces to be treated to the surface treatment by the plasma between the member to be treated and the plurality of the counter electrodes. According to such configuration, the surface treatment is performed by regulating the respective electric constants between the respective surfaces to be treated of the member to be treated and the corresponding electrodes so as to make the constants approximately equal to each other and therefore the respective surfaces to be treated can be subjected to the uniform surface treatment by the one process. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281796(A) 申请公布日期 2005.10.13
申请号 JP20040099075 申请日期 2004.03.30
申请人 TOYOTA MOTOR CORP;SHIBAURA MECHATRONICS CORP 发明人 KAGAMI NAOTO;HIRAKI NAOZUMI;TAKIZAWA HIROTSUGU;UTSUNOMIYA NOBUAKI;AKUTSU SHIGERU;KURIYAMA NOBORU
分类号 H05H1/46;C23C16/509;C23C16/52;C23F4/00;H01M8/02 主分类号 H05H1/46
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