发明名称 Conductive film forming composition, conductive film, and method for forming the same
摘要 There are provided a conductive film forming composition capable of forming wiring or an electrode which can be suitably used in a variety of electronic devices, easily and inexpensively, a method for forming a film using the composition, a conductive film formed by the method, and wiring or an electrode which comprises the film. A conductive film forming composition comprising a complex of an amine compound and aluminum hydride and an organic solvent is applied on a substrate and then subjected to a heat treatment and/or irradiation with light, whereby a conductive film such as an electrode or wiring is produced.
申请公布号 US6953600(B2) 申请公布日期 2005.10.11
申请号 US20030410154 申请日期 2003.04.10
申请人 INTERNATIONAL CENTER FOR MATERIALS RESEARCH 发明人 YOKOYAMA YASUAKI;MATSUKI YASUO;SAKONO IKUO;KOBAYASHI KAZUKI;TAKEUCHI YASUMASA
分类号 C23C18/08;C23C18/10;C23C18/14;C23C18/16;H01B5/14;H01B13/00;H01J9/02;H01L21/288;H01L21/768;H01L23/498;H05K3/10;H05K3/24;(IPC1-7):B05D5/12 主分类号 C23C18/08
代理机构 代理人
主权项
地址