发明名称 |
Conductive film forming composition, conductive film, and method for forming the same |
摘要 |
There are provided a conductive film forming composition capable of forming wiring or an electrode which can be suitably used in a variety of electronic devices, easily and inexpensively, a method for forming a film using the composition, a conductive film formed by the method, and wiring or an electrode which comprises the film. A conductive film forming composition comprising a complex of an amine compound and aluminum hydride and an organic solvent is applied on a substrate and then subjected to a heat treatment and/or irradiation with light, whereby a conductive film such as an electrode or wiring is produced.
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申请公布号 |
US6953600(B2) |
申请公布日期 |
2005.10.11 |
申请号 |
US20030410154 |
申请日期 |
2003.04.10 |
申请人 |
INTERNATIONAL CENTER FOR MATERIALS RESEARCH |
发明人 |
YOKOYAMA YASUAKI;MATSUKI YASUO;SAKONO IKUO;KOBAYASHI KAZUKI;TAKEUCHI YASUMASA |
分类号 |
C23C18/08;C23C18/10;C23C18/14;C23C18/16;H01B5/14;H01B13/00;H01J9/02;H01L21/288;H01L21/768;H01L23/498;H05K3/10;H05K3/24;(IPC1-7):B05D5/12 |
主分类号 |
C23C18/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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