发明名称 |
Multilayer printed circuit board laminate and process for manufacturing the same |
摘要 |
The method involves providing a circuit board blank (1) comprising a substrate (2) and at least one electrically conductive layer (3) of a thickness that is suitable for carrying power currents. The thickness of part of the conductive layer (3) is reduced to create a signal conduction layer. The conductive layer has a thickness DL, where 150 mumat mostDLapproximately600 mum, preferably DL400 mum. An Independent claim is included for a multilayer circuit board module. |
申请公布号 |
EP1363483(A3) |
申请公布日期 |
2005.10.05 |
申请号 |
EP20030010758 |
申请日期 |
2003.05.14 |
申请人 |
ROTRA LEITERPLATTEN PRODUKTIONS- UND VETRIEBS-GMBH |
发明人 |
OPITZ, RUDI WALTER;STUCKMANN, WALTER PAUL FRITZ;KOPF, REINHOLD |
分类号 |
H05K1/00;H05K1/02;H05K3/06;H05K3/42 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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