| 发明名称 |
Dielectric composition for forming dielectric layer for use in circuitized substrates |
| 摘要 |
<p>A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.</p> |
| 申请公布号 |
EP1583108(A1) |
申请公布日期 |
2005.10.05 |
| 申请号 |
EP20050251747 |
申请日期 |
2005.03.22 |
| 申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
JAPP, ROBERT;PAPATHOMAS, KOSTAS |
| 分类号 |
C08K7/00;H01B3/00;H01L23/14;H05K1/00;H05K1/03;H05K3/46;(IPC1-7):H01B3/00 |
主分类号 |
C08K7/00 |
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