发明名称 SUBSTRATE DIVIDING APPARATUS AND METHOD FOR DIVIDING SUBSTRATE
摘要 A substrate dividing apparatus for dividing a substrate comprises a scribe line forming means for forming a scribe line on a substrate and a breaking means for breaking the substrate along the scribe line. The breaking means includes a means which makes a vertical crack under the scribe line extend in the thickness direction of the substrate by spraying a heated fluid onto the scribe line formed on the substrate, which fluid has a temperature high enough to have the substrate expand.
申请公布号 KR20050095912(A) 申请公布日期 2005.10.04
申请号 KR20057014009 申请日期 2005.07.29
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 NISHIO YOSHITAKA
分类号 B28D5/00;C03B33/027;C03B33/033;C03B33/04;C03B33/09;C03B33/10 主分类号 B28D5/00
代理机构 代理人
主权项
地址