| 发明名称 |
Electronic and optoelectronic component packaging technique |
| 摘要 |
A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.
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| 申请公布号 |
US6952046(B2) |
申请公布日期 |
2005.10.04 |
| 申请号 |
US20030460852 |
申请日期 |
2003.06.13 |
| 申请人 |
FOSTER-MILLER, INC. |
发明人 |
FARRELL BRIAN;JAYNES PAUL;TAYLOR MALCOLM |
| 分类号 |
H01L21/50;H01L23/04;H01L23/06;H01L23/10;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/50 |
| 代理机构 |
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