发明名称 Foam material embedding device for embedding earphone has earphone layer between upper and lower foam layers, such that a funnel-shaped hole layer is formed on top of the upper foam layer
摘要 <p>A frame has rounded corners. A funnel-shaped hole layer (1) is formed on the top center of the frame. The earphone (5) is embedded under a foam layer (2). A foam layer (4) is formed under the earphone layer. Preferably, a plastic foam layer is provided between foam material (2) and earphone layer (3), and between earphone layer (3) and foam layer (4).</p>
申请公布号 DE202005006343(U1) 申请公布日期 2005.09.29
申请号 DE20052006343U 申请日期 2005.04.21
申请人 KORN, WOLFGANG 发明人
分类号 H04R1/10;H04R25/00;(IPC1-7):H04R1/10 主分类号 H04R1/10
代理机构 代理人
主权项
地址