发明名称 |
Foam material embedding device for embedding earphone has earphone layer between upper and lower foam layers, such that a funnel-shaped hole layer is formed on top of the upper foam layer |
摘要 |
<p>A frame has rounded corners. A funnel-shaped hole layer (1) is formed on the top center of the frame. The earphone (5) is embedded under a foam layer (2). A foam layer (4) is formed under the earphone layer. Preferably, a plastic foam layer is provided between foam material (2) and earphone layer (3), and between earphone layer (3) and foam layer (4).</p> |
申请公布号 |
DE202005006343(U1) |
申请公布日期 |
2005.09.29 |
申请号 |
DE20052006343U |
申请日期 |
2005.04.21 |
申请人 |
KORN, WOLFGANG |
发明人 |
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分类号 |
H04R1/10;H04R25/00;(IPC1-7):H04R1/10 |
主分类号 |
H04R1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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