| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing electronic components and electronic device which can be stably inputted with temperature compensation information from the outside via pads for electrical check, even if the length and thickness of each side of an insulation substrate become very small with reduction in size and thickness of the package for storing electronic components. SOLUTION: The package for storing electronic components comprises the insulation substrate 1 having a first concave 4 for storing a first electronic component 3 on the top face and a second concave 6 for storing a second electronic component 5 on the bottom face, an interconnection conductor 11 extracted from the inner surface of each of the first concave 4 and second concave 6 to the external surface of the insulation substrate 1, hollow portion 8 formed around the second concave 6 formed on the bottom face of the insulation substrate 1, and the pads 9 for electrical check which are formed on the inner surface of the hollow portion 8 and are electrically connected to the interconnection conductor 11. COPYRIGHT: (C)2005,JPO&NCIPI |
