| 摘要 |
PROBLEM TO BE SOLVED: To promote high-density packaging by making a pitch fine, by enhancing the separation-resistant properties of a conductor without increasing the conductive width and securing improved insulating characteristics between conductors and migration-resistant properties even in a printed-wiring board in which a conductive circuit is formed by an additive method. SOLUTION: A conductive circuit 14 is formed on an insulating base 11, conductive width La in a part 14A for packaging electronic components in the conductive circuit 14 is set to be a conductive width requested by the packaging of electronic components, conductive width Lb in a part 14B other than that is narrowed as compared with the conductive width La of a part for packaging electronic components, and the part 14B in which the conductive width is narrower than the conductive width of the part 14A for packaging electronic components is covered with a solder resist layer 16, thus increasing the separation-resistant strength of the conductive circuit 14. COPYRIGHT: (C)2005,JPO&NCIPI
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