| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a tape wiring substrate, by which manufacturing processes is simplified, thereby reducing the manufacturing cost. <P>SOLUTION: A method of manufacturing a tape wiring substrate includes steps of: preparing a base film, a step of forming a metal layer on the base film; processing the metal layer into a wiring pattern, by partially etching the metal layer using a laser radiated to the metal layer; and forming a wiring pattern by wet etching. By this method, a fine wiring pattern, having fine pitches, is formed in simplified processes with reduced cost. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
