| 发明名称 |
Integrated circuit die and substrate coupling |
| 摘要 |
A system may include a pre-formed portion of underfill material defining openings. The openings may be configured to pass electrical interconnects for coupling an integrated circuit die to a portion of a substrate. |
| 申请公布号 |
US2005212105(A1) |
申请公布日期 |
2005.09.29 |
| 申请号 |
US20040807022 |
申请日期 |
2004.03.23 |
| 申请人 |
|
发明人 |
WALK MICHAEL J. |
| 分类号 |
H01L21/56;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
