| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus which can efficiently perform deposition on a large-sized substrate and uniformizes a deposition distribution. SOLUTION: The sputtering apparatus includes a sputtering cathode group comprising a plurality of sputtering cathodes installed in prescribed arrangement in a direction perpendicular to a moving direction of the large-sized substrate moving in a prescribed direction. The sputtering cathodes are preferably circular. The sputtering cathode group is desirably a first sputtering cathode array comprising a plurality of the sputtering cathodes arranged at prescribed intervals in the direction perpendicular to the moving direction of the large-sized substrate moving in the prescribed direction. Further, the sputtering cathode group preferably includes a second sputtering cathode array which is disposed apart prescribed intervals from the first sputtering cathode array in the above moving direction and is disposed in the positions not overlapping on the respective sputtering cathodes of the first sputtering cathode array in the moving direction. COPYRIGHT: (C)2005,JPO&NCIPI
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