发明名称 Cooling system for electronic apparatus, and electronic apparatus using the same
摘要 <p>An electronic apparatus, such as personal computers of desktop type and notebook type, as well as a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU (200) in need of cooling is installed within a housing (100), and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket (50); a radiator (60); and a circulation pump (70), wherein the heat-receiving (cooling) jacket (50), for transmitting heat generated from a heat-generation element, i. e., the CPU, into a liquid coolant flowing within an inside thereof, has a heat diffusion plate (90) attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid (94), such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements (95), being provided in contact with a portion the operating fluid. To those heater elements (95) are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming/extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin (300).</p>
申请公布号 EP1577739(A2) 申请公布日期 2005.09.21
申请号 EP20040005452 申请日期 2004.03.08
申请人 HITACHI, LTD. 发明人 SUZUKI, OSAMU
分类号 H05K7/20;F28D15/02;F28D15/06;F28F7/00;F28F13/10;G06F1/20;H01L23/34;H01L23/36;H01L23/473;(IPC1-7):G06F1/20 主分类号 H05K7/20
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