Flexible substrate, multilayer flexible substrate and process for producing the same

摘要

A flexible substrate (100,110,120) comprising:
(i) a film (1);(ii) an insulating resin layer (2a,2b) formed on each of front face of said film (1) and rear face of said film (1), said rear face being opposite to said front face.;(iii) a front-sided wiring pattern (3a) embedded in the insulating resin layer (2a) formed on said front face of said film (1), and a rear-sided wiring pattern (3b) embedded in the insulating resin layer (2b) formed on said rear face of said film (1); and(iv) a via (4) which is located between the front-sided wiring pattern (3a) and the rear-sided wiring pattern (3b) and serves to electrically connect said front-sided wiring pattern (3a) and said rear-sided wiring pattern (3b);    wherein said insulating resin layer (2a,2b) formed on each of said front face and said rear face of the said film (1) is thicker than said film (1).