发明名称 Semiconductor device and method for manufacturing the same
摘要 A semiconductor device and a method for forming the same. A dielectric layer is formed on a semiconductor substrate or on a lower electrode of a capacitor. Vacuum annealing is performed on the dielectric layer. Thus, impurities remaining in the dielectric layer can be effectively removed, and the dielectric layer can be densified. As a result, the electrical characteristics of the semiconductor device are improved. For example, the leakage current characteristics of the dielectric layer are improved and capacitance is increased.
申请公布号 US6946342(B2) 申请公布日期 2005.09.20
申请号 US20030452979 申请日期 2003.06.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YEO JAE-HYUN;KIM SUNG-TAE;KIM YOUNG-SUN;PARK IN-SUNG;WON SEOK-JUN;LEE YUN-JUNG;IM KI-VIN;PARK KI-YEON
分类号 H01L27/04;H01L21/02;H01L21/31;H01L21/314;H01L21/316;H01L21/469;H01L21/8242;H01L27/108;H01L29/76;H01L29/94;H01L31/119;(IPC1-7):H01L21/824 主分类号 H01L27/04
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