发明名称 |
Manufacturing method of an integrated chip |
摘要 |
A manufacturing method of an integrated chip. The integrated chip includes at least two devices with different functions. The method uses a first production line to form a first device on a semiconductor wafer and then uses a second production line to form a second device on the semiconductor wafer so as to complete the integrated chip. |
申请公布号 |
US6946343(B2) |
申请公布日期 |
2005.09.20 |
申请号 |
US20030249374 |
申请日期 |
2003.04.03 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
LIOU FU-TAI |
分类号 |
H01L21/8239;(IPC1-7):H01L21/824;H01L21/336 |
主分类号 |
H01L21/8239 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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