发明名称 Manufacturing method of an integrated chip
摘要 A manufacturing method of an integrated chip. The integrated chip includes at least two devices with different functions. The method uses a first production line to form a first device on a semiconductor wafer and then uses a second production line to form a second device on the semiconductor wafer so as to complete the integrated chip.
申请公布号 US6946343(B2) 申请公布日期 2005.09.20
申请号 US20030249374 申请日期 2003.04.03
申请人 UNITED MICROELECTRONICS CORP. 发明人 LIOU FU-TAI
分类号 H01L21/8239;(IPC1-7):H01L21/824;H01L21/336 主分类号 H01L21/8239
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