发明名称 FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 <p>A flexible printed wiring board having a stable quality, not generating curls on a film even after circuit process on a conductor side, and a method of manufacturing such flexible printed wiring board are provided. The flexible printed wiring board is provided with a base layer, which is composed of at least one type of low thermal expansion polyimide resin, between a bottom layer contacting the conductor and a top layer on the opposite side to the conductor. The bottom layer and the top layer are composed of a thermoplastic polyimide rein having a larger thermal expansion coefficient than that of the base layer, and a thickness P1 of the bottom layer and a thickness P2 of the top layer satisfy a condition of P1&lt;P2.</p>
申请公布号 WO2005086547(A1) 申请公布日期 2005.09.15
申请号 WO2005JP04100 申请日期 2005.03.09
申请人 NIPPON STEEL CHEMICAL CO., LTD.;HIGASAYAMA, ICHIRO;SATO, SEIJI 发明人 HIGASAYAMA, ICHIRO;SATO, SEIJI
分类号 H05K1/03;(IPC1-7):H05K1/03 主分类号 H05K1/03
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