发明名称 |
FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>A flexible printed wiring board having a stable quality, not generating curls on a film even after circuit process on a conductor side, and a method of manufacturing such flexible printed wiring board are provided. The flexible printed wiring board is provided with a base layer, which is composed of at least one type of low thermal expansion polyimide resin, between a bottom layer contacting the conductor and a top layer on the opposite side to the conductor. The bottom layer and the top layer are composed of a thermoplastic polyimide rein having a larger thermal expansion coefficient than that of the base layer, and a thickness P1 of the bottom layer and a thickness P2 of the top layer satisfy a condition of P1<P2.</p> |
申请公布号 |
WO2005086547(A1) |
申请公布日期 |
2005.09.15 |
申请号 |
WO2005JP04100 |
申请日期 |
2005.03.09 |
申请人 |
NIPPON STEEL CHEMICAL CO., LTD.;HIGASAYAMA, ICHIRO;SATO, SEIJI |
发明人 |
HIGASAYAMA, ICHIRO;SATO, SEIJI |
分类号 |
H05K1/03;(IPC1-7):H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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