| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding pad which has good electrical connection even when an anisotropic conductive film is used, and a flexible wiring board lead. SOLUTION: A flexible wiring board lead comprises a bonding pad which has at least two finger-like portions 132 and 134, and a notch 133 formed between the adjacent finger-like portions. The notch 133 is preferably formed so that it extends from the periphery to the center of the bonding pad. The bonding pad is preferably made of a copper alloy or an aluminum alloy. The bonding pad is preferably formed in a portion of the flexible wiring board lead. The bonding pad is preferably used for connection using an anisotropic conductive film. COPYRIGHT: (C)2005,JPO&NCIPI |
