发明名称 DEVICE FOR ARRANGING MATERIAL TO TIP
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a device for arranging a material to the tips by which a material is accurately and uniformly arranged to all of the tips of a plurality of protrusions. <P>SOLUTION: A catalyst arranging device 30 is a device for arranging a material constituting the catalyst 3 to all of the tips of a plurality of emitter chips 1 formed to a substrate 2. The substrate 2 and the emitter chips 1 are held by a holding part 4 and maintained at a temperature higher than the melting point of the catalyst 3 by a heater 4a. A drive mechanism 6 is controlled by a controller 9 and accurately changes the distance between the substrate 2 and the catalyst 3 by controlling the holding parts 4, 5 while maintaining a parallel state of the substrate 2 and the catalyst 3. The drive mechanism 6 is moved so that only the tips of the emitter chips 1 are brought into contact with the catalyst 3 and the tips of the emitter chips 1 are quickly separated from the catalyst 3 after the contact. At that time, the catalyst 3 is melted by the contact with the emitter chips 1 whose temperature is set to exceed the melting point of the catalyst 3 by a heater 5. The melted catalyst 3 is transferred only to the tips of the emitter chips 1. Hence, the catalyst 3 is uniformly and accurately arranged to all of the tips of a plurality of the emitter chips 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005246507(A) 申请公布日期 2005.09.15
申请号 JP20040057124 申请日期 2004.03.02
申请人 PIONEER ELECTRONIC CORP 发明人 OKANO MAKOTO;KUMASAKA OSAMU
分类号 B82B3/00;C01B31/02;H01J9/02;H01L29/06;H01L29/66;(IPC1-7):B82B3/00 主分类号 B82B3/00
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