| 摘要 |
PROBLEM TO BE SOLVED: To provide an application film formation device and an application film formation method which can prevent insufficient attaching of a treatment liquid in a nozzle tip and can apply the treatment liquid to the treatment substrate uniformly when a film is formed by applying the treatment liquid to the treatment substrate. SOLUTION: The device has a resist supply nozzle 51 having a slit-like discharge port 51a extending in the widthwise direction of a substrate G, a discharge control means 88 for controlling discharge of a resist liquid R from the resist supply nozzle 51, a priming roller 52 which is installed in the standby position of the resist supply nozzle 51 and is formed to rotate freely, and a roller rotation control means 92 for controlling rotation of the priming roller 52. In the standby position after the discharge control means 88 discharges a prescribed amount of the resist liquid R from the resist supply nozzle 51, the roller rotation control means 92 starts rotation of the priming roller 52 after prescribed time T. COPYRIGHT: (C)2005,JPO&NCIPI
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