| 摘要 |
A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module ( 5 ) through the medium of cooling water includes a base member ( 1 ), a heat sink body ( 2 ) superposed on the base member ( 1 ) to form in cooperation with the base member ( 1 ) a passage through which the coolant flows, and a bellows-like flow straightening plate ( 6 ) disposed between the power semiconductor module ( 5 ) and the base member ( 1 ) in physical contact with the power semiconductor module ( 5 ) on one hand and with the base member ( 1 ) on the other hand. The flow straightening plate ( 6 ) partitions the passage into a plurality of flow straightening channels ( 14 A, 14 B).
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