| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing methods for a semiconductor device and a camera module capable of reducing a product in size while improving productivity and reducing the cost thereof. SOLUTION: Following steps are carried out, i.e., steps of manufacturing a plurality of image sensor parts in a wafer state, covering the wafer surface on which the plurality of image sensor parts manufactured in the preceding step are mounted with a protection sheet, dividing the plurality of image sensor parts into individual image sensor chips by carrying out dicing from the wafer surface on the opposite side of the wafer surface covered with the protection sheet in the preceding step, fetching one of the image sensor chips divided in the preceding step and joining the fetched image sensor chip to a wiring board, bonding a translucent member which transmits externally incident light to the wiring board, and mounting a lens housing member including a lens on the wiring board with reference to the translucent member bonded to the wiring board in the preceding step. COPYRIGHT: (C)2005,JPO&NCIPI |
