发明名称 Method of molding low melting point metal alloy
摘要 The present invention relates to a method of molding a low-melting-point metal alloy which exhibits thixotropy properties in a solid-phase and liquid-phase coexisting temperature region. In this method, a temperature of a heating holding cylinder is increased to a liquidus temperature or higher at the start of a molding operation. Then a remaining material in the preceding molding remaining in the heating holding cylinder in a solid state is perfectly melted. After that a temperature of the heating holding cylinder is lowered to a temperature in the solid-phase and a liquid-phase coexisting temperature region. At the same time a molding material is supplied and a provisional molding is carried out. After the temperature has reached the solid-phase and liquid-phase coexisting temperature region, a regular molding is started. By the present invention a problem of a remaining material in the heating holding cylinder, which becomes a trouble at the start of molding by injection is solved.
申请公布号 US2005194116(A1) 申请公布日期 2005.09.08
申请号 US20050066598 申请日期 2005.02.25
申请人 ANZAI KAZUO;TAKEI KOJI;YAMAZAKI KO 发明人 ANZAI KAZUO;TAKEI KOJI;YAMAZAKI KO
分类号 B22D17/30;B22D17/00;B22D17/02;B22D17/08;B22D23/00;B22D25/00;(IPC1-7):B22D17/08 主分类号 B22D17/30
代理机构 代理人
主权项
地址