| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an RF-ID medium with an antenna and land part formed on a base substrate by printing, capable of having a sufficient clearance between a lower surface of an IC chip and the land part, and preventing a state where the IC chip and the land part are not electrically connected. <P>SOLUTION: When the IC chip 10 is pressed to the base substrate 31, with the antenna 20 and the land parts 21a, 21b formed by printing, so that bumps 11a, 11b provided on the IC chip 10 are connected to the land parts 21a, 21b, the IC chip 10 is pressed to the base substrate 31 with a load applied to one of the bumps 11a, 11b provided on the IC chip 10 becomes 150-350 mN. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
