METHOD FOR FORMING METALLIC FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a homogeneous metallic plating film having a secure adhesion to an insulation layer of a thin film of a printed circuit board etc., without damaging the insulation layer. SOLUTION: The method for forming the metallic film on the insulation layer comprises: (1) a process of irradiating the surface of the insulation layer formed of an insulation resin composition containing dielectric particles of≥30 in dielectric constant and insulation resin with radiation in the presence of particles having a photocatalyst function; (2) a process of forming a seed layer by using an electroless plating solution of pH 5 to 9; and (3) a process of forming the metallic film on the seed layer by (3) electroplating. COPYRIGHT: (C)2005,JPO&NCIPI