发明名称 Semiconductor device and manufacturing method of the same
摘要 A semiconductor device includes a compound semiconductor substrate, a channel layer provided on the compound semiconductor substrate, a buried layer provided on the channel layer, a first recess formed in the buried layer in an E-mode region, a second recess formed in the first recess in the E-mode region and another second recess formed in the buried layer in a D-mode region, and a gate electrode provided in the second recess in the E-mode region and another gate electrode provided in the second recess in the D-mode region, and a distance between a surface of the buried layer and a bottom of the second recess in the E-mode region is shorter than another distance between another surface of the buried layer and a bottom of said another second recess in the D-mode region.
申请公布号 US2005189584(A1) 申请公布日期 2005.09.01
申请号 US20050034920 申请日期 2005.01.14
申请人 EUDYNA DEVICES INC. 发明人 MATSUDA HAJIME
分类号 H01L27/095;H01L21/338;H01L27/06;H01L27/088;H01L29/778;H01L29/812;H01L31/062;(IPC1-7):H01L31/062 主分类号 H01L27/095
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