FORMATION OF PHOTOCONDUCTIVE AND PHOTOVOLTAIC FILMS

摘要

A deposition system (10) includes a vacuum reaction chamber (11) with a substrate holder (23) positioned in it. The substrate holder (23) is for carrying a substrate (24) therein. A sputtering apparatus (21) is also positioned in the vacuum reaction chamber. The sputtering apparatus (21) is configured to direct sputtered material towards the substrate (24) to form a sputtered material region thereon. A plasma enhanced chemical vapor deposition (PECVD) apparatus is positioned in the vacuum reaction chamber (11). The PECVD apparatus is configured to deposit a PECVD material region thereon the substrate (24). The first PECVD apparatus includes a first PECVD electrode (27) movable from a first position towards the substrate (24) and a second position away (103) from the substrate.