发明名称 Reflow soldering method
摘要 A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.
申请公布号 US6935553(B2) 申请公布日期 2005.08.30
申请号 US20030413564 申请日期 2003.04.15
申请人 SHINKO SEIKI CO., LTD. 发明人 SUGA TADATOMO;SAITO KEISUKE;MATSUURA YOSHIKAZU;TAKEUCHI TATSUYA;KAGAMI JOHJI;KATO RIKIYA;YAMAGATA SAKIE
分类号 B23K1/008;B23K1/20;H05K3/34;(IPC1-7):B23K31/02;B23K31/00;B23K35/36 主分类号 B23K1/008
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