| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treating method easily controlling uniformity of treatment of the substrates with a simple control system. SOLUTION: A two-fluid nozzle 50 is so controlled as to reduce a spot diameter of washing liquid, when the nozzle 50 is on one end of an outer periphery on a substrate W. Then, when the nozzle 50 has moved slightly inward from the one end of the outer periphery of the substrate W, the nozzle 50 is so controlled as to maximize the spot diameter of the washing liquid. As the nozzle 50 moves toward a central part of the substrate W, the nozzle is so controlled as to gradually reduce the spot diameter of the washing liquid, while, when the nozzle 50 is on the center of the substrate W, the nozzle is so controlled as to minimize the spot diameter of the washing liquid. COPYRIGHT: (C)2005,JPO&NCIPI
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