A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure (505). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.
申请公布号
WO2005076794(A2)
申请公布日期
2005.08.25
申请号
WO2005US01529
申请日期
2005.01.12
申请人
FREESCALE SEMICONDUCTOR, INC.;FAY, OWEN, R.;AMRINE, CRAIG, S.;LISH, KEVIN, R.