发明名称 METHOD FOR CORRECTING MASK DATA, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To correct a mask pattern by an OPC (optical proximity effect correction) process highly precisely and to suppress a undesired data process time and a data amount from increasing. <P>SOLUTION: The mask data correction method is carried out by subjecting a pattern figure of a photomask to a proximity effect correction process so as to obtain a desired figure and dimension as a pattern in a photosensitive material film on a substrate to be processed or in an objective film to be processed by using the photosensitive film. After the pattern figure of the photomask is subjected to model-based proximity effect correction, the predictive figure of the pattern in the photosensitive material film or the pattern in the objective film to be processed by using the photosensitive film is calculated from the pattern figure of the photomask, and the error between the calculated predictive figure and the desired figure is calculated. Then the pattern figure of the photomask is further corrected by rule-based proximity correction based on the error calculated in a preset attentional portion. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005227666(A) 申请公布日期 2005.08.25
申请号 JP20040038034 申请日期 2004.02.16
申请人 TOSHIBA CORP 发明人 KANAI HIDEKI
分类号 G03F1/30;G03F1/36;G03F1/68;G03F1/70;G06F17/50;H01L21/027 主分类号 G03F1/30
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