发明名称 |
Bonding method and bonding apparatus |
摘要 |
Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship of <?in-line-formulae description="In-line Formulae" end="lead"?>(vibration-axial directional holding force)>(die shear strength)+(inertial force)<?in-line-formulae description="In-line Formulae" end="tail"?> while applying an ultrasonic vibration to a region which is subjected to bonding.
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申请公布号 |
US6932262(B2) |
申请公布日期 |
2005.08.23 |
申请号 |
US20030626522 |
申请日期 |
2003.07.25 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KURITA YOICHIRO;NOGAWA JUN;MAEDA MASATO;INOMATA TERUJI |
分类号 |
H01L21/60;B23K1/06;B23K20/10;B23K31/00;H01L21/30;H01L21/607;(IPC1-7):B23K1/06 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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