| 摘要 |
FIELD: electronic engineering; gas panel manufacture. ^ SUBSTANCE: proposed dielectric composition incorporates low-melting glass and high-melting filler powders wherein particles of low-melting glass and high-melting filler powders have at least one of following shapes: spherical, cylindrical, or planar; amounts of low-melting glass and high-melting filler are chosen from equation , where k1 = rho1/rho2 is factor characterizing physical of low-melting glass and high-melting filler; k2 = V1/V2 is factor characterizing packing density of particles of low-melting glass and high-melting filler powders; m1 and m2 is amount of low-melting glass and high-melting filler, respectively, g; rho1 and rho2 is density of low-melting glass and high-melting filler, respectively. V1 and V2 is volume occupied by low-melting glass and high-melting filler, respectively, cm3. ^ EFFECT: enhanced structure density of structural components. ^ 1 cl, 1 tbl |
