发明名称 Integrated driver circuit configuration for an inductive load element
摘要 In one embodiment, an integrated driver circuit configuration for an inductive load element includes a highly doped substrate of p-conductivity, an epitaxial layer having the same conductivity type as the substrate and being applied on the substrate, an output terminal for connecting the inductive load element, a plurality of insulated wells being disposed in the epitaxial layer and having a well associated with the output terminal, and an n-doped region laterally surrounding the well associated with the output terminal. In another embodiment, the integrated driver circuit configuration for the inductive load element includes a highly doped substrate of p-conductivity, an epitaxial layer applied on the substrate, a plurality of insulated wells having an n-doped well, an n-doped region laterally surrounding the n-doped well, and an output terminal for connecting the inductive load element. An npn transistor has an emitter formed by the n-doped well, a collector formed by the n-doped region, and a base formed by the epitaxial layer.
申请公布号 US5719431(A) 申请公布日期 1998.02.17
申请号 US19950417825 申请日期 1995.04.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 WERNER, WOLFGANG
分类号 H01F7/18;H01L21/822;H01L27/02;H01L27/04;H03K17/64;(IPC1-7):H01L29/00;H01L27/082 主分类号 H01F7/18
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