| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a coil device for miniaturization as a whole and easy manufacturing, capable of coping with rasing of inductance. <P>SOLUTION: A coil device A1 comprises a substrate 1, a wiring pattern 2 formed on the substrate 1, and a core 4 mounted on the substrate 1. A plurality of conductive lead wires 31 are so connected by an insulating member 32 as to be arrayed with intervals in widthwise direction, with a lead wire aggregate 3 mounted on the substrate 1. The lead wire aggregate 3 is so formed as both ends in lengthwise direction of each lead wire 31 or its nearby part rises from the substrate 1 in bent shape or in bow, to form a tunnel-like space S on the substrate 1. The core 4 is arranged in the tunnel-like space S, and the wiring pattern 2 is conductive to each lead wire 31 to allow conduction of coil current to each lead wire 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
