发明名称 FLUX COMPOSITION FOR SOLDERING, AND SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide flux for soldering and solder paste having high reliability, wherein the wettability and the storage stability of solder are enhanced, flux resides after the soldering are colorless and transparent, and no cracks are generated even when being subjected to temperature change. SOLUTION: The flux composition for soldering contains phosphor-containing latent carboxylic acid and a compound having at least one carboxylic group and at least one reactive functional group in which chemical bond is formed by heating. The solder paste consists of the flux composition and solder powder blended with each other. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005219056(A) 申请公布日期 2005.08.18
申请号 JP20040026196 申请日期 2004.02.03
申请人 NOF CORP 发明人 SAITO TAKASHI;TAKIZUKA NORIKAZU
分类号 B23K35/363;(IPC1-7):B23K35/363 主分类号 B23K35/363
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