| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of accurately connecting the electrode of a semiconductor chip and the leads of a substrate. SOLUTION: A method for manufacturing a semiconductor device comprises steps of imaging a formation surface of an electrode 32 and the formation surface of a lead 12 along an axis orthogonal to XY axis plane, and obtaining a projection image of the formation surface of the electrode 32 and the formation surface of the lead 12 to a surface orthogonal to Z-axis. Regarding the projection image, a gap between an image of the electrode 32 and an image of the lead 12 is calculated. A transformation value, required for eliminating the gap caused by the expansion or the contraction of one of at least the substrate 10 and the semiconductor chip 30, is calculated. Change in the temperature, required to obtain the transformation value of one of at least the substrate 10 and the semiconductor chip 30, is calculated. The temperature of at least one of the semiconductor chip 30 and the substrate 10 is made to vary, on the basis of the change in the temperature. COPYRIGHT: (C)2005,JPO&NCIPI |
