| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method and electroplating equipment capable of preventing the flow of a large current, such as a surge current, between a main substrate and an auxiliary substrate after the end of formation of a plating layer and well maintaining the quality of the plating layer by appropriately controlling switching and controlling output before discharging a plating solution after the plating and forming of the prescribed plating layer in particular. SOLUTION: The current value to be supplied between the main substrate and a anode is dropped to a weak current or controlled to zero in the current value after the plating layer is formed and before the plating solution is discharged. Thereby, the current charge within the circuit can be reduced and at the time of switching for electrically connecting the main substrate and the auxiliary substrate to each other, the flow of the large current, such as the surge current, between the main substrate and the auxiliary substrate is suppressed and the weak current of the prescribed magnitude can be supplied between the main substrate and the auxiliary substrate. Consequently, the dissolution of the plating layer plated and formed on the main substrate can be suppressed and the deterioration of the quality of the plating layer can be suppressed at the time of discharging the plating solution. COPYRIGHT: (C)2005,JPO&NCIPI
|
