| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for polishing a wafer and wafer polishing equipment used to polish a wafer capable of obtaining the thickness of a film being polished without the need to separate the wafer from the base plate and of controlling polishing highly precisely and efficiently. <P>SOLUTION: In the polishing method in which a wafer with a film is pressed against the base plate for polishing, the surface of the wafer to be polished is irradiated with light by causing the light to penetrate a partial region of the base plate and by monitoring the light having penetrated the region and reflected by the wafer, the thickness of the film being polished is measured. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
