| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for containing an electronic component which exhibits high airtightness by bonding a lid to the surface of the package for containing an electronic component with high strength. SOLUTION: The package comprises an insulating substrate 1 having an upper surface on which the mounting part 1a of an electronic component 4 is formed, a wiring conductor 5 formed on the upper surface of the insulating substrate 1, and a frame-like metallize layer 3 formed at the outer circumferential part on the upper surface of the insulating substrate 1 to surround the mounting part 1a. A plurality of protrusions 3a are formed on the surface of the metallize layer 3 such that a protrusion located on the outermost side on the upper surface of the insulating substrate 1 becomes wider than that located on the innermost side. COPYRIGHT: (C)2005,JPO&NCIPI
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