| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and a manufacturing method for the same which suppress a failure of wire breaking and enables the formation of a wiring pattern by electroplating. SOLUTION: The manufacturing method for the circuit board includes a conductive member arranging step of arranging a conductive member 1 on a molding die 2, a molding step of molding a resin molded body 3 that covers a part of the conductive member 1, a circuit pattern forming step of forming a circuit pattern 4 which is connected electrically to the conductive member 1 on the surface of the resin molded body 3, and a circuit forming step of energizing the circuit pattern 4 with currents via the conductive member 1 and forming a circuit 5 on the surface of the resin molded body 3 by electroplating. The conductive member 1 has a spring part 6, which can expand/contract in a direction in which the resin molded body 3 expands/contracts as it hardens in the molding step. As the spring part 6 of the conductive member 1 expands/contracts in response to the expansion/contraction of the resin molded body 3, a formation failure and/or breaking of the circuit pattern 4 are suppressed at the interfaces between the resin molded body 3 and the conductive member 1. COPYRIGHT: (C)2005,JPO&NCIPI
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