| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that when an active metal is used for bonding non-oxide ceramics to each other or for bonding a non-oxide ceramic to a metal member, a stably bonded body with high strength can not be obtained. SOLUTION: The bonded body is prepared by bonding the non-oxide ceramic members to each other or by bonding the non-oxide ceramic member to the metal member with a solder containing a metal component having a liquidus temperature of 1,200°C or lower as a main component and at least one metal selected from V, Ti, Zr, and Hf as an active metal. The proportion of an oxide of the active metal in a reaction layer between the solder and the non-oxide ceramic member is in a range of 5-90 atom%. COPYRIGHT: (C)2005,JPO&NCIPI
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