FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which an adhesion strength is firm without acting an adhesive and in which fine patterning is possible. SOLUTION: In the flexible printed circuit having a metal conductor layer formed on a plastic film, fine irregularities which set an average spacing between convex parts or between recesses to 10 nm to 80 nm are formed by a nitrogen plasma treatment on the plastic film before the metal conductor layer is formed, and then a mixed layer of the metal and the plastic film material is formed in thickness of 0.01μm or less on the plastic film. COPYRIGHT: (C)2005,JPO&NCIPI